FACHPACK Visitors to Discover How Esko Innovations Accelerate Packaging Production
Esko will use this year’s FACHPACK trade fair to showcase how its latest innovations are helping brands and packaging converters to accelerate go-to-market of goods.
From 24-26 September 2024, visitors to the Nuremberg event will discover Esko’s cutting-edge cloud technology, sophisticated estimating software, and state-of-the-art platemaking and inline inspection hardware.
“Representing a significant advancement in software architecture, the new Esko S2 platform is a multi-tenant cloud-native platform that delivers on a new technological reality based on cloud computing, data sharing, and artificial intelligence,” said Jan De Roeck, Esko Director of Marketing, Industry Relations & Strategy. “All strategic Esko applications – from ArtPro+, ArtiosCAD, and the award-winning Phoenix through to Cape Pack and Automation Engine – connect to the new platform, giving all stakeholders in the value chain 24/7 real-time access to live data and identical resources, wherever in the world they reside. Moreover, Esko S2 is an open platform supporting connectivity with partners.
At FACHPACK, we will demonstrate how Esko S2 is providing a next-generation solution, enabling brands and their packaging supply chains to access connected, cloud-based operations, driving unprecedented go-to-market speed and efficiency.
As well as introducing visitors to its newest software platform, Esko will be demonstrating its AVT 100% print inspection system, including its new AVT Varnish Inspection Module. From booth 328 in Hall A of the exhibition center, Esko will showcase how the new module – for the Esko AVT Helios system – facilitates viewing and inspection of varnish and coating on various printed substrates simultaneously with print inspection. This unique and patented Varnish Inspection Module detects issues such as varnish misregister, partial and full starvation simultaneously with the existing print defect detection.
The AVT print inspection module is truly groundbreaking, enabling labels converters to inspect and detect defects in varnish coatings during a live label print run.
“As an add-on to the Helios system, the Varnish Inspection Module enables the simultaneous review and monitoring of varnish and coating on multiple printed materials, enabling labels converters to achieve maximum output while reducing waste in their print production process.
“We are looking forward to meeting with our partners, customers and colleagues at FACHPACK, and to showcase these latest innovations that deliver on our promise to automate, connect and accelerate the go-to-market process for packaged goods,” said Jan.
Visit the Esko team at FACHPACK, booth #328 in Hall 3A of the Exhibition Center Nuremburg, from 24-26 September 2024.
For more on the Esko suite of software and hardware solutions, visit www.esko.com